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Difference between revisions of "Packaging/SUSE"

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The [http://www.b1-systems.de/index.php?lang=en/ B1 Systems] provides a technical whitepaper in german language which describes the setup of [[OpenStack]] on top of SUSE Linux Enterprise Server 11 SP1 using Diablo. The whitepaper is available [http://www.b1-systems.de/openstack here].
 
The [http://www.b1-systems.de/index.php?lang=en/ B1 Systems] provides a technical whitepaper in german language which describes the setup of [[OpenStack]] on top of SUSE Linux Enterprise Server 11 SP1 using Diablo. The whitepaper is available [http://www.b1-systems.de/openstack here].
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At the moment we provide packages for the following projects:
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* keystone: [[OpenStack]] Identity Service
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* glance: [[OpenStack]] Image Service
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* nova: [[OpenStack]] Compute
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* horizon: [[OpenStack]] Dashboard
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* swift: [[OpenStack]] Object Storage
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* quantuum: [[OpenStack]] Virtual Network Service
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* melange: [[OpenStack]] Network Information Service
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* tempest: [[OpenStack]] Integration Test Suite
  
 
This packaging work is thanks to the efforts of:
 
This packaging work is thanks to the efforts of:

Revision as of 14:12, 25 February 2012

SUSE packaging

B1 Systems provides OpenStack packages for OpenSUSE and SLE through the openSUSE Build Service. You can find the packages in the subprojects from isv:B1-Systems:OpenStack.

Development packages (normally the latest succeeded builds from Jenkins) are located in the project isv:B1-Systems:OpenStack:devel.

Packages of milestones (isv:B1-Systems:OpenStack:milestone) and releases (isv:B1-Systems:OpenStack:release) are also available.

For all our packages we suggest to use the requirements provided in the project isv:B1-Systems:OpenStack:requirements and to not use other packages (we only test those packages).

The B1 Systems provides a technical whitepaper in german language which describes the setup of OpenStack on top of SUSE Linux Enterprise Server 11 SP1 using Diablo. The whitepaper is available here.

At the moment we provide packages for the following projects:

This packaging work is thanks to the efforts of: